Taiwan Semiconductor Manufacturing Company. Ltd features unveiled a new and possibly debatable strategy that involves more effort in the early stages in the IC style process.
TSMC's program is definitely aimed to reduce development periods and production costs, in accordance to experts. But it can also possibly result in a major mix in the industry, while the silicon foundry large wants a lot of IC cake and seems to be encroaching within the turf in the third-party EDA, IP, the labels and test communities.
As part of its technique, TSMC is definitely quietly driving a concept named the Available Innovation System (OIP), relating to Gartner Inc. During its technology conference the other day, TSMC as well disclosed details about its plan in the chip-packaging front, which include its inner efforts inside the 3D market.
OIP is known as a program that requires more " collaboration involving the foundry as well as clients on the early stages in the design phase, " said Jim Master, an analyst with Gartner, in an e-mail newsletter.
TSMC's OIP consists of a platform of design equipment and IP to help consumers with their design-to-manufacturing efforts, Walker said. " OIP combines TSMC's production technologies, silicon IP, substantial manufacturing repository and appropriate third-party silicon IP and design equipment, " he said.
" Through OIP, TSMC can offer vertically built-in services, from designing and manufacturing to testing and packaging, thus shortening clients' IC development processes and reducing all their manufacturing costs, " he said.
Concern for opponents
Many of these initiatives could be seen as competitive to TSMC's current partnerships inside the EDA, IP and IC-packaging communities. For example , " this kind of announcement must be of concern towards the SATS market companies (that is, agreement assembly and test houses), such as Amkor Technology, Advanced Semiconductor Architectural, Siliconware Precision Industries Limited, STATS ChipPAC, UTAC while others, " Walker wrote. " This expansion in companies...